- Electronics
- Toys and Children's Products
- Textiles, Footwear, Leather and Luggage
- Food , Drug and Cosmetic
- Auto Materials and Parts
- Metal materials and parts
- Building Materials and Light Industry Products
- Luxury Products
- Semiconductor and related Fields
- Electronic Commerce
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Industry
Service
slice analysis
slice analysis
Purpose: Surface and internal defect inspection of electronic components and SMT process improvement & Validation.
Scope of application: Suitable for structure analysis of electronic components, PCBA welding defects, solder joints tin morphology and defect detection.
Use the instrument: Precision cutting machine, embedding machine, grinding and polishing machine, metallographic microscope, electron microscope, etc.
The test process: Sampling -- embedment -- grinding -- polishing -- corrosion -- observation and photography
Routine inspection standard: IPC-TM650-2.1.1/2.25 IPC-A-610D
The sample type:
1. PCB structural defects: PCB layering, hole copper fracture, etc.
2. PCBAWelding quality inspection:
a. BGA void welding, virtual welding, hole, bridge, tin area, etc；
b. Analysis of product structure: analysis of copper foil layer number of capacitor and PCB, ANALYSIS of LED structure, analysis of electroplating process, defects of internal structure of materials, etc；
c. Micro size measurement (generally greater than 1um): porosity size, tin height, copper foil thickness, etc
Service
- Adhesive and tape testing
- Material hardness test
- Failure analysis and testing of composite materials
- Electronic process material testing
- Failure analysis and testing of electronic components
- Mechanical testing of materials
- Nondestructive testing of industrial products
- Failure analysis and testing of metal materials and components
- slice analysis
- Nondestructive testing of electronic products
- PCB&PCBA failure analysis and detection