- Electronics
 - Toys and Children's Products
 - Textiles, Footwear, Leather and Luggage
 - Food , Drug and Cosmetic
 - Auto Materials and Parts
 - Metal materials and parts
 - Building Materials and Light Industry Products
 - Luxury Products
 - Semiconductor and related Fields
 - Electronic Commerce
 - Certification
 - Occupational Safety and Health
 - Environment
 - Inspection
 - Audit
 - Training
 
Industry
Service
Electronic process material testing
Electronic process material testing
Test item
| 
			 Flux testing  | 
			
			 Solder paste inspection  | 
			
			 Solder wire inspection  | 
			
			 Adhesive testing  | 
			
			 Insulation paint testing  | 
		
| 
			 1. appearance  | 
			
			 1. viscosity  | 
			
			 1. Flux content  | 
			
			 1. viscosity  | 
			
			 1. The original paint appearance  | 
		
| 
			 2. density(g/cm3)  | 
			
			 2. Tin beads test  | 
			
			 2. OD(outer diameter)  | 
			
			 2. shear strength  | 
			
			 2. transparency  | 
		
| 
			 3. solid content  | 
			
			 3. The collapse test  | 
			
			 3. Spray test  | 
			
			 3. Spread out/collapse  | 
			
			 3. sheet resistivity  | 
		
| 
			 4. Help welding sex  | 
			
			 4. Wettability test  | 
			
			 4. Detection of tin bath  | 
			
			 4. High temperature strength  | 
			
			 4. Flash point  | 
		
| 
			 5. Copper mirror corrosion test  | 
			
			 5. Flux content  | 
			
			 5. Welding continuity/uniformity  | 
			
			 5. Dielectric constant  | 
			
			 5. Thick layer of dry  | 
		
| 
			 6. Physical stability  | 
			
			 6. Sample preparation  | 
			
			 6. Sample preparation  | 
			
			 6. curing  | 
			
			 6. Volume resistivity  | 
		
| 
			 7. Water extraction fluid resistivity  | 
			
			 7. Grain size shape distribution  | 
			
			 7. Residual dryness  | 
			
			 7. Hot and  | 
			
			 7. Breakdown strength  | 
		
| 
			 8.. Residual dryness  | 
			
			 8. Dielectric strength  | 
			
			 8. Bibulous rate  | 
		||
| 
			 9. Acid value(mgKOH/gFlux)  | 
			
			 9. Shear strength after welding  | 
			
			 9. Oil resistance  | 
		||
| 
			 10. Corrosion of copper plate  | 
			
			 10. Volume resistivity  | 
			
			 10. bending  | 
		||
| 
			 11. Surface insulation resistance  | 
			
			 11. Surface resistivity  | 
			
			 11. Heat resistance  | 
		||
| 
			 12. electromigration  | 
			
			 12. Solvent resistance  | 
			
			 12. The drying time  | 
		||
| 
			 13. Mould test  | 
			
			 13. Mildew resistance  | 
			
			 13. Solid content  | 
		||
| 
			 14. electromigration  | 
			
			 14. Acid value  | 
		|||
| 
			 15. viscosity  | 
		
Routine inspection of cleaning agent:
| 
			 Specific gravity or density  | 
			
			 Electrical conductivity  | 
			
			 residues(wt%)  | 
			
			 Boiling point or range  | 
			
			 Insulation resistance(Ω)  | 
		
| 
			 Ph of water extract (pH)  | 
			
			 Normal temperature volatilization rate (25℃, mg/s.cm2)  | 
			
			 Flash point  | 
			
			 Dielectric strength(kV/mm) Or pressure(kV)  | 
			
			 Corrosivity (to metal) (copper, 100℃, 3h)  | 
		
| 
			 Corrosive to plastics (polyimide plastics, epoxy plastics, phenolic resins, polypropylene plastics only)  | 
		||||
Cleaner withoutODSCertification testing:
| 
			 appearance  | 
			
			 Physical stability  | 
			
			 Distillation range  | 
			
			 Electrical conductivity  | 
			
			 pH  | 
		
| 
			 Physical stability  | 
			
			 Corrosion test  | 
			
			 residues(wt%)  | 
			
			 Metal ions,  | 
			
			 Flash point(℃)  | 
		
| 
			 density  | 
			
			 viscosity  | 
			
			 Surface tension  | 
			
			 breakdown voltage  | 
			
			 moisture  | 
		
| 
			 Dynamic surface insulation resistance  | 
			
			 Boiling point or range  | 
			
			 Material compatibility test  | 
			
			 Cleaning temperature difference  | 
			
			 Partial discharge initial voltage(PDIV)  | 
		
| 
			 Baker's rosin butanol value (KB value)  | 
			
			 Normal temperature volatilization rate(25℃, mg/s.cm2)  | 
		|||
Service
- Adhesive and tape testing
 - Material hardness test
 - Failure analysis and testing of composite materials
 - Electronic process material testing
 - Failure analysis and testing of electronic components
 - Mechanical testing of materials
 - Nondestructive testing of industrial products
 - Failure analysis and testing of metal materials and components
 - slice analysis
 - Nondestructive testing of electronic products
 - PCB&PCBA failure analysis and detection
 
